Worldwide Semiconductor Packaging Equipment Market 2016 Geographical segmentation, Size, Trends, Growth and Forecasts
Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.
Semiconductor packaging offers the following benefits to wafers:
- Prevents corrosion
- Offers protection in case of impact
- Dissipates heat produced in the device
- Secures the contact leads or pins used to plug in the device to its external circuits
Publisher’s analysts forecast the global semiconductor packaging equipment market to grow at a CAGR of 8.04% during the period 2016-2020.
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Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor packaging equipment to the end-users – OSATs and IDMs.
The market is divided into the following segments based on geography:
- APAC
- Europe
- North America
Publisher’s report, Global Semiconductor Packaging Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
- Applied Materials
- ASM Pacific Technology
- Kulicke and Soffa Industries
- Tokyo Electron Limited
- Tokyo Seimitsu
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Other prominent vendors
- ChipMos
- Greatek
- Hua Hong
- Jiangsu Changjiang Electronics Technology
- Lingsen Precision
- Nepes
- Tianshui Huatian
- Unisem
- Ultratech
Market driver
- High demand for polymer adhesive wafer bonding equipment
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Market challenge
- Fluctuation of foreign exchange rates
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Market trend
- Growing number of mergers and acquisitions
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