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ESD Packaging Market Rising at 8.23% CAGR To 2021
ESD Packaging Market is Projected to grow at 8.23% CAGR during the period 2017-2021. Network Consulting Industry research report also provides granular analysis of the market share, segmentation, revenue forecasts and geographic regions of the market.
Marketsizeforecasters.com adds new global ESD Packaging market: report that lists top active companies as BASF, Desco Industries, Dow Chemical, and PPG Industries.
Other Prominent Vendors in the market are: AkzoNobel, DaklaPack Group, Dou Yee, GWP Group, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.
Research Analysts forecast the global ESD Packaging market to grow at a CAGR of 8.23% during the period 2017-2021.
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Commenting on the report, an analyst from team said: One trend in market is high adoption of technology in automobiles. The electrification and automation of automobiles have increased the demand for semiconductor wafers. Multiple types of semiconductor integrated circuits (ICs) are used in automobiles for airbag control, global positioning systems, anti-lock braking systems, car navigation and display, power doors and windows, infotainment, automated driving, and collision detection technology. The emergence of new technologies, such as artificial intelligence will lead to the emergence of self-driving cars in future. Companies such as Intel, Google, Uber, and Tesla are already investing and focusing on self-driving vehicles. In November 2016, for example, Intel announced its new division, Automated Driving Group, which will focus on autonomous driving. Intel has also tied up with automotive firms such as BMW for the division.
The listed pricing for this ESD Packaging Market report starts at $ 3500.
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According to the report, one driver in market is increasing miniaturization of electronic devices. There has been an increase in the demand for mobility in electronic devices worldwide. To be portable and cost-effective, devices need to be lightweight and small. Thus, the increased demand for mobility has translated into a trend toward the adoption of smaller devices. The popularity of smaller devices in multiple sectors such as telecommunications and automotive has, in turn, led to the miniaturization of semiconductor ICs. With the advances in technology, such as 3D ICs and micro-electromechanical systems (MEMS), as well as the changes in the designs of ICs such as finer patterning, electronic devices are becoming more compact and user-friendly. However, smaller and densely-built semiconductors, ICs, and PCBs have more chances of tribocharging, and thus require anti-static packaging.
Further, the report states that one challenge in market is high dependence on electronics industry. The ESD packaging market is heavily dependent on the global performance of the electronics industry. In the case of a global economic meltdown, the sales of electronic products are impacted adversely because these products are capital intensive. The ripple effect is felt in the semiconductor equipment market as semiconductors comprise major components in electronic products. As semiconductor sales go down, the sales of semiconductor packaging materials also go down. The global recession of 2009, for example, was one of the most harrowing periods for companies across the semiconductor value chain because of the global economic meltdown. At present, the slow growth of China is a concern for the global electronics market. China’s growth rate fell from 9.6% in 2011 to 6.9% in 2015. It has reduced further during the first three quarters of 2016 to around 6.7%. China consumes and produces more than 50% of the raw materials, such as semiconductors.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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