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Fan-out Wafer Level Packaging Market to Grow at 47.46% CAGR to 2021
The market research report ‘Global Fan-out Wafer Level Packaging Market 2017-2021’aims to offer insights into new business opportunities for companies such as STATS ChipPAC, TSMC, and Texas Instruments.
Marketsizeforecasters.com adds new global Fan-out Wafer Level Packaging market: report that lists top active companies as STATS ChipPAC, TSMC, and Texas Instruments.
Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, and Ultratech.
Other Prominent Vendors in the market are: Clariant, ERCO Worldwide, Imerys, SNF Floerger, and Solvay.
Research Analysts forecast the global Fan-out Wafer Level Packaging market to grow at a CAGR of 47.46% during the period 2017-2021.
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Commenting on the report, an analyst team said: One trend in market is high adoption of semiconductor ICs in automobiles. The automation and electrification of automobiles have increased the need for semiconductor wafers. Several types of semiconductor ICs are used in automotive products such as GPS, airbag control, anti-lock braking system (ABS), power doors and windows, car navigation and display, infotainment, collision detection technology, and automated driving. This will push the demand for WLP solutions for IC packaging used in the automobile segment.
The listed pricing for this Fan-out Wafer Level Packaging Market report starts at $ 3500.
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According to the report, one driver in market is growing application of semiconductor ICs in IoT. IoT is one of the fastest growing markets in the world, and more than 30 billion devices are estimated to be connected through the IoT by 2020, generating a total of about 52 trillion GBs of data. The devices connected through the IoT use sensors and actuators to collect and transmit data to a centralized location on a real-time basis. As this empowers the user to take an informed decision, the adoption of the IoT is increasing in several market segments, such as the consumer electronics, automotive, and medical. Furthermore, governments of many countries such as India are undertaking smart city projects, which will support the demand for IoT devices during the forecast period. For instance, smart city applications such as smart electronic meters use semiconductor devices to monitor the fluctuation in electricity transmission and consumption and send signals to adjust the flow of the current.
Further, the report states that one challenge in market is reliability issues in wafer-level SiP. Reliability of SiP is a significant challenge due to the heterogeneous integration of several elements that have several interconnect technologies in 2D and 3D construction due to the high number of interfaces, complex process flows, several materials, and their coefficients of thermal expansion and temperature budget during processing. This is challenging for WLSiP, including FOWLP. However, it is less critical due to the use of thin-film processing instead of flip-chip and wire bond and smaller package dimensions. FOWLP technology is efficient in the designing of power modules; however, there are technical reliability issues affecting the market adoption of FOWLP technology in the global market.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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A rugged (or ruggedized, but also ruggedised) computer is a computer specifically designed to operate reliably in harsh usage environments and conditions, such as strong vibrations, extreme temperatur…About Us:
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