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The latest extreme ultraviolet (EUV) lithography systems are making about 28 wafers per hour or 100 wafers per day with a 40 W light source in pilot tests. The progress is significant but falls far short of a production target of up to 200 wafers per hour for the systems upon which ride many of the hopes of the semiconductor industry.
ASML chief technology officer Martin Van den Brink reported the results achieved over the last three months, raising hopes for a handful of EUV proponents at the annual Imec Technology Forum here. The systems could be available as early as 2016 in time for the 10 nanometer node, Van den Brink said, but it's a nail biter at best, given the many challenges ahead.