Intel and Georgia Tech developed a modeling platform to advance spintronics interconnect research

Georgia Institute of Technology, in collaboration (and sponsorship) from Intel developed a physics-based modeling platform that advances spintronics interconnect research for next-generation computing.

The researchers are focusing on developing spintronics switches with adequate connectivity. They are researching the communicating between spin-logic devices and they demonstrated that interconnects are an even more important challenge for beyond-CMOS switches.

To analyze spintronic interconnects, the Georgia Tech team and their Intel collaborators have developed compact models for spin transport in copper and aluminum—taking into account the scattering at wire surfaces and grain boundaries that become quite dominant at nanoscale dimensions. The research team has also developed compact models for the nanomagnet dynamic, electronic and spintronic transport through magnet to non-magnet interfaces, electric currents and spin diffusion. These models are all based on familiar electrical elements such as resistors and capacitors and can therefore be analyzed using standard circuit simulation tools such as SPICE.

Source: SRC