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Nanoscale, 2015, Accepted Manuscript
DOI: 10.1039/C5NR03079J, Communication
Ji-Beom Yoo, Seul-Gi Kim, Dong-Wook Shin, Taesung Kim, Sooyoung Kim, Jung Hun Lee, Changgu Lee, Cheol Woong Yang, Sungjoo Lee, Sang Jin Cho, Hwan Chul Jeon, Mun Ja Kim, Byung-Gook Kim
Extreme ultraviolet lithography (EUVL) has received much attention in the semiconductor industry as a promising candidate to extend dimensional scaling beyond 10 nm. We present a new pellicle material, nanometer-thick…
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